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Lab: Prototype Package and Design Report

Course 3 · Module 6 Type: Capstone / handoff package Suggested time: ~3 hours (+ separate time for printing/assembling)

Read first: Lesson · Design report · ← TOC · ← M05

Keep these tabs open

Section titled “Keep these tabs open”
Document Why
3D Print Toolbox manifold check
M05 checklist Top 3 fixes before print
Hackathon optional sensor proof in enclosure

Lab Goals

Section titled “Lab Goals”

Submit the package that closes Course 3, complete with files, the report, and fitment/test evidence.

Prerequisites

Section titled “Prerequisites”
  • M05 gave a Ready decision, or you have a fix plan already carried out
  • You have the latest .blend + .glb
  • A deliverables folder, for example course3-final/

Lab A — Apply M05 fixes (required)

Section titled “Lab A — Apply M05 fixes (required)”
  1. Open the Top 3 from M05
  2. Fix them in Blender in priority order (at least what time allows)
  3. Save the final .blend
  4. Export a new .glb if the Twin model changed

Pass when: the report states which items were fixed and which are still outstanding

Lab B — Mesh check and export STL (required)

Section titled “Lab B — Mesh check and export STL (required)”
  1. Open 3D Print Toolbox
  2. Check All on the parts to be printed
  3. Fix non-manifold geometry until it passes well enough for the lab
  4. Export at least 1 STL (enclosure_base.stl and/or enclosure_lid.stl)
  5. Open it in a slicer and check the units are mm

Pass when: there is an STL file and either a slicer screenshot, or a passing Check All list

Lab C — Print or print plan (required)

Section titled “Lab C — Print or print plan (required)”
Track What to do
C1 — Printer available Print at least one part · photograph the printed piece
C2 — No printer State the service/machine · the material · the expected time · and measurement evidence comparing the board with the model

Pass when: there is a printed photo or a verifiable print plan + measurement evidence

Lab D — Fitment with hardware (required)

Section titled “Lab D — Fitment with hardware (required)”
  1. Place/compare the PCB against the base
  2. Check the ports, sensor openings, the lid
  3. Take photos from at least 2 angles
  4. Log each Pass/Fail result in Design Report §7

Pass when: there is a genuinely filled-in fitment table, with no whole section left blank

Lab E — Firmware / Twin / web-app check (required)

Section titled “Lab E — Firmware / Twin / web-app check (required)”

Choose at least one piece of evidence:

  • The LED/button working inside the box, or while held up against it
  • Telemetry in Bitstream Studio
  • Hackathon ex05 or ex06 after assembly

Pass when: the report states the result as “the sensor still reads correctly / reads but is degraded / could not be tested yet because…”

Lab F — Design report package (required)

Section titled “Lab F — Design report package (required)”
  1. Fill in design-report-template.md completely
  2. Attach the file list in §9
  3. At least 3 next-iteration recommendations
  4. Attach or summarise the M05 checklist
  5. Confirm there is no password in the submitted files

Deliverables checklist

Section titled “Deliverables checklist”
Item Done?
.blend
.glb
STL (≥1)
Design report
M05 checklist
Fitment photos / measurement evidence
Firmware/Twin/web-app note

Troubleshooting

Section titled “Troubleshooting”
Symptom What to try
The slicer says the mesh is broken 3D Print Toolbox · Make Manifold · check the normals
The STL is the wrong size Apply Scale · check the mm units · check the scale in the slicer
The PCB won’t fit Go back to the Top 3 from M05 · don’t file it down without noting that in the report
Sensors go quiet inside the box The opening is blocked · the material is too thick · or a cable came loose — check one layer at a time
No printer available Fully complete Track C2 — don’t leave it blank

Lesson · Design report · TOC

Cite this lesson

If you teach from this lesson or reuse it in slides or documents, credit it with the text below. If you changed it, add (adapted) after the title.

"Lab: Prototype Package and Design Report" from TESA Open Knowledge by the Thai Embedded Systems Association (TESA), https://github.com/tesaiot/tesa-qualification-program, licensed under CC BY-NC 4.0

Thai attribution: "แล็บ Capstone: แพ็กเกจต้นแบบและ Design Report" จาก TESA Open Knowledge โดยสมาคมสมองกลฝังตัวไทย (Thai Embedded Systems Association: TESA) https://github.com/tesaiot/tesa-qualification-program สัญญาอนุญาต CC BY-NC 4.0

Lesson link: https://tesaiot.github.io/tesa-qualification-program/en/courses/product-design/m06-prototyping/l02-lab/

This lesson adapts the source below; keep its credit too.
https://github.com/drsanti/TESAIoT-Courses/blob/287c21814ba8c75f693136616dcd270349a15966/C3/M06/lab.md · Original content by Asst. Prof. Dr. Santi Nuratch (ผศ.ดร.สันติ นุราช), KMUTT. Course 3 (C3/) of drsanti/TESAIoT-Courses. TESA funded the work and holds the rights; published here under CC BY-NC 4.0. The upstream repository carries no licence file. Text kept faithful; structure, front matter, quizzes and notes added by TESA Open Knowledge.

Full guide: how to cite TESA

TESA Open Knowledge · © 2026 สมาคมสมองกลฝังตัวไทย (TESA) · CC BY-NC 4.0

Content is licensed CC BY-NC 4.0. Reuse it non-commercially and credit the Thai Embedded Systems Association (TESA) every time. · How to cite TESA