Communication Skills
Lessons that develop this skill
Section titled “Lessons that develop this skill”| Lesson | Course | Develops to |
|---|---|---|
| Where to go next, and how to share it right | Explorer: Meet Embedded Systems | L1 Aware |
| Build and present your AIoT mini-product | AIoT in Action: From Touch Screen to IoT Platform (MicroPython) | L2 Guided |
| SensorHub: one dashboard for every sensor (series project) | TESAIoT Firmware Stack: C Firmware on the TESAIoT Dev Kit | L2 Guided |
| Writing a brief for developers: the one-page decision canvas | Edge AI & IoT for Product Decisions | L2 Guided |
| Production Files, Prototype Fitment and the Design Report | Product Industrial Design (Blender & Twin) | L2 Guided |
| Lab: Prototype Package and Design Report | Product Industrial Design (Blender & Twin) | L2 Guided |
| Plan the Capstone and Use the Resource Map | TESA Firmware SDK for Edge AI | L2 Guided |
| Lab: Capstone Mini Project | TESA Firmware SDK for Edge AI | L2 Guided |
| End-to-end Testing on the Digital Twin | Firmware Development with the VS Code-based TESA Digital Twin | L2 Guided |
| Lab: E2E Mini-Project on Digital Twin | Firmware Development with the VS Code-based TESA Digital Twin | L2 Guided |
| Capstone: one secure device | Secure IoT with OPTIGA™ Trust M | L2 Guided |
| Hands-on: build and ship an edge AI app | Edge AI Developer: From Sensor to On-Device Model | L2 Guided |
| Citing TESA in your university course | Educator Kit | L2 Guided |
Lessons that assess this skill
Section titled “Lessons that assess this skill”| Lesson | Level | Evidence |
|---|---|---|
| Lab: Prototype Package and Design Report | L2 Guided | README.md#deliverables-checklist |
| Lab: Capstone Mini Project | L2 Guided | README.md#deliverables-checklist |
Roles that use this skill
Section titled “Roles that use this skill”| Role | Minimum level | In this role |
|---|---|---|
| Edge AI Engineer | L3 Independent | Required (R) |
| Educator | L4 Professional | Required (R) |
| Embedded Security Engineer | L3 Independent | Required (R) |
| Firmware Developer | L3 Independent | Required (R) |
| IoT Device Developer | L3 Independent | Required (R) |
| Product Entrepreneur / Product Owner | L3 Independent | Required (R) |
Proficiency levels
Section titled “Proficiency levels”- L1 Aware · Bloom: remember/understand
- L2 Guided · Bloom: apply (scaffolded)
- L3 Independent · Bloom: apply/analyse
- L4 Professional · Bloom: analyse/evaluate
- L5 Design & Lead · Bloom: evaluate/create
For Open Badges 3.0 and CASE alignment
Section titled “For Open Badges 3.0 and CASE alignment”UUID: 6032ea55-53dc-5097-91b8-8f6e0570f7aa
{ "type": [ "Alignment" ], "targetName": "Communication Skills", "targetUrl": "https://tesaiot.github.io/tesa-qualification-program/skills/soft.communication/", "targetCode": "soft.communication", "targetFramework": "TESA Embedded Systems Skill Map 0.1.0", "targetType": "CFItem"}Skill map data is licensed CC BY-SA 4.0, adapted from the Embedded Systems Engineering Roadmap by Meysam Parvizi
TESA Open Knowledge · © 2026 สมาคมสมองกลฝังตัวไทย (TESA) · CC BY-NC 4.0
Content is licensed CC BY-NC 4.0. Reuse it non-commercially and credit the Thai Embedded Systems Association (TESA) every time. · How to cite TESA