Industrial & Enclosure Design

Skill id

hwdev.enclosure

Area

Hardware

Group

Prototyping Skills

Roadmap importance

No roadmap colour (added by TESA)

Origin

Added by TESA

Status in the lesson library

Assessed by a lesson

See it on the skill roadmap

Lessons that develop this skill

Lesson	Course	Develops to
Industrial Design Principles and a True-scale Enclosure	Product Industrial Design (Blender & Twin)	L2 Guided
Lab: Block Model Enclosure at Hardware Scale	Product Industrial Design (Blender & Twin)	L2 Guided
Enclosure Detail, PBR Materials and Presentation Renders	Product Industrial Design (Blender & Twin)	L2 Guided
Lab: Refine Model, PBR, and Render	Product Industrial Design (Blender & Twin)	L2 Guided
Open/Close Animation and Interference Checks	Product Industrial Design (Blender & Twin)	L2 Guided
Digital Validation before Prototyping	Product Industrial Design (Blender & Twin)	L2 Guided
Lab: Scenarios and Pre-Prototype Checklist	Product Industrial Design (Blender & Twin)	L2 Guided
Production Files, Prototype Fitment and the Design Report	Product Industrial Design (Blender & Twin)	L2 Guided
Lab: Prototype Package and Design Report	Product Industrial Design (Blender & Twin)	L2 Guided

Lessons that assess this skill

Lesson	Level	Evidence
Lab: Block Model Enclosure at Hardware Scale	L2 Guided	README.md#deliverables-checklist
Lab: Scenarios and Pre-Prototype Checklist	L2 Guided	README.md#deliverables-checklist
Lab: Prototype Package and Design Report	L2 Guided	README.md#deliverables-checklist

Roles that use this skill

Role	Minimum level	In this role
Product Entrepreneur / Product Owner	L2 Guided	Required (R)

Proficiency levels

• L1 Aware · Bloom: remember/understand
• L2 Guided · Bloom: apply (scaffolded)
• L3 Independent · Bloom: apply/analyse
• L4 Professional · Bloom: analyse/evaluate
• L5 Design & Lead · Bloom: evaluate/create

For Open Badges 3.0 and CASE alignment

UUID: 06c30242-94fd-5a85-89f6-175f98e24c2b

{
  "type": [
    "Alignment"
  ],
  "targetName": "Industrial & Enclosure Design",
  "targetUrl": "https://tesaiot.github.io/tesa-qualification-program/skills/hwdev.enclosure/",
  "targetCode": "hwdev.enclosure",
  "targetFramework": "TESA Embedded Systems Skill Map 0.1.0",
  "targetType": "CFItem"
}

Skill map data is licensed CC BY-SA 4.0, adapted from the Embedded Systems Engineering Roadmap by Meysam Parvizi